Check whether the marking, main body and leads of components meet the standard

To verify the device logo , part number, design time, bonding lines, and others

Without damaging the chip, detect the packaging of components, such as bubbles, abnormal bond line, die size, bracket direction, etc

Through the test, confirm the marking status of the device

Check whether the component pin is consistent with the datasheet

Test whether various chemical elements meet international standards

Test pin's ability to reliably weld to PCB

Test the ability of the device to withstand high temperature, low temperature, cold and hot shock environment

Verify whether the components are original factory and original materials

Test the electrical performance parameters of components in non-working state, including pin open circuit test, pin short circuit, Idd test, DC Leakage, and pin matching

Program, verify, Erase, burn procedures, blank check, one-time device check

Verify the functions of components according to specifications

Analyze the failure cause of the failed sample

Verify the high frequency characteristics of microwave chip according to specifications

Verify the parameters of IGBT according to the specification

The device is baked at high temperature and vacuum-packed according to the requirements of humidity sensitivity level